Cenex-LCV incorporates four key features: Technology exhibition split over three halls; Extensive seminar programme; Facilitated networking; Ride & drive of the latest research & development and commercially available vehicles.
LCV is run by Cenex, the UK's first centre of excellence for low carbon and fuel cell technologies with assistance from Supporting Partners including the Department for Business, Energy and Industrial Strategy, the Centre for Connected and Autonomous Vehicles, the Office for Zero Emission Vehicles, the Department for International Trade, the Advanced Propulsion Centre, the Automotive Council, Innovate UK, Zemo Partnership, Zenzic, the Society of Motor Manufacturers and Traders, and Connected Places Catapult.
Wales is globally recognised as a leading location for the development and delivery of emerging technologies with a dynamic and innovative automotive sector, and the World’s first Cluster of Excellence dedicated to compound semiconductor technology which underpins the future of high value manufacturing. Welsh Government’s climate change pledge and ambition has meant an investment in skills & research that matches the desire to innovate.
Welsh companies attending:
Microchip Technology Caldicot Ltd.
At the event itself, join us on the Wales Stand C3-117 for our 3@3 session. 3 companies on the Wales stand will each hold a 3 minute pitch starting at 3pm on the 6th of September.
15:00 – Dawson Shanahan started out working on Lancaster Bombers! After WWII they produced the copper components for the first power semiconductor devices, from virtually pure copper (OFHC these days). They pioneered the use of precision cold-forming to reduce both material and machining time. Since 1943, they’ve partnered with customers in almost every sector of industry, from automotive and motorsports to aviation, power distribution, electronics and medical.
15:03 – CSconnected’s Phil Cornish will lead you through the expertise available at CSconnected - the World’s first Compound Semiconductor Cluster. Phil will update on the “next generation” materials that offer enhanced properties over silicon technologies in terms of power, speed and photonics.
15:06 – RAM Innovations is a bespoke and highly flexible service provider to the semiconductor and electronics industries. They have extensive expertise in embedded die packaging (EDP), collaborating with partners at the leading edge of semiconductor systems development. Come and hear about their integrated cooling solution and half-bridge building block solution.
Don’t miss out on the opportunity to learn more about these fantastic companies and their advances in technology and innovation. You will have a chance to speak with each company afterwards, and ALL the stand partners on the Wales stand.
